As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Putting the silicon membranes on the receiving wafer. (University of Illinois Urbana-Champaign) In recent years, computer ...

Subscribe to our newsletter for the latest sci-tech news updates. Through new research published in Nature, Qing Cao and colleagues at the University of Illinois Urbana-Champaign have developed a new ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

The Albany NanoTech complex, operated by NY Creates, is going to be home to a new chip lithography center funded by more than $2 billion in state and federal grants. The center is key to the ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...

Growing cells in three dimensions is critical for studying how tissues behave in the body, yet most laboratory platforms remain either too simple or too complex to use widely. Researchers now present ...

From the Robert Mehrabian College of Engineering News article "Galan Moody, 4 Co-PIs Secure $1.15 Million for Advanced 3D Printing” ...