Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability.

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Good morning, good evening. Thank you all for attending the conference call with ASE. I'm Sunny Lin, covering Greater China [ Semis ] at UBS. It's my great honor to host Mr. Yin Chang, Executive VP of ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...

Richardson Electronics, Ltd. (NASDAQ: RELL) today announced a new global strategic partnership with NoMIS Power, a leading ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

Enphase Energy, Inc. (NASDAQ: ENPH), a global energy technology company, today published a technical white paper titled “Enphase Adoption of GaN Bi-Directional Switch Technology for Distributed Power ...