Imec and Sony have developed a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalisation technologies. The module is structured ...

Abstract: In this design, a high-performance five-channel receiving module is presented. The module integrates amplification, band-pass filtering, and automatic gain control (AGC) functionalities.

Abstract: This paper presents a 3-D integrated hybrid package using phase change vapor chamber (VC), flexible printed circuit (FPC), direct plating copper (DPC) and diamond. This package improves ...

Wood Mackenzie’s supplier assessment framework is widely referenced to evaluate module manufacturers’ bankability and operational capability. The qualification process considers ten criteria with ...

Lawrence, Paul R., and J. W. Lorsch. Organization and Environment. Boston, MA: Harvard Business School, Division of Research, 1967. (Reissued as a Harvard Business ...